334
K.-L. Lin
Table 11.1 The solder alloys and structures for microbumps
Microbump structure
Bonding technology References
5.4 µm Cu/3.6 µm Sn/9.5 µm Cu
TCB 240, 260 °C
[3]
Cu/Sn/Cu
TCB
[4]
20 µm Cu/SnAg/3 µm Ni
Reflow
[5]
Cu/Ni/Sn2.5Ag/Ni/Cu
TCB
[6]
Cu/Ni/SnAg/Ni/Cu
Reflow
[7]
300Å Cr/500Å Cu/35 µm Cu/35 µm SAC405
(not available)
[8]
Ti/Cu(seed)/Cu(wire)/3.0 µm Cu/3.5 µm SnAg
TCB at 280 °C
[9]
Cu/Ni/Sn
TCB at <250 °C
[10]
Cu/Ni/SnAg
TCB
[11]
30 µm Cu/3 µm Ni/25 µm SnAg
Reflow
[12]
33 µm Cu/25 µm SnAg
Reflow
[12]
50 µm Cu/20 µm SAC305
TCB
[13]
42 µm Cu/3 µm Ni/35 µm Solder
TCB
[14]
28 µm Cu/2 µm Ni/15 µm SnAg
TCB
[15]
Cu/Ni/Sn 2.5Ag
TCB
[16]
5 µm Cu/2 µm Ni/8 µm Sn57Bi
Reflow at 180 °C
[17]
5 µm Cu/2 µm Ni/8 µm SAC305
Reflow
[17]
Cu/Ni/Sn
(not available)
[18]
100 nm Ti/200 nm Cu/12 or 8 µm Cu/10 or 25 µm SAC305 Reflow
[19]
100 nm Ti/200 nm Cu/12 µm Cu/2 µm Ni/10 µm SAC305 Reflow
[19]
NiFe/Pb-free solder (undefined)
Reflow
[20]
NiFe/Cu/Pb-free solder (undefined)
Reflow
[20]
8 µm Cu/SnAg
Reflow
[21]
8 µm Cu/Ni/SnAg
Reflow
[21]
5 µm Cu/3 µm Ni/5 µm Sn 2.5Ag
TCB
[22]
2 µm Cu/5 µm Sn (on substrate)
TCB
[23]
Cu/Sn/Ni/Cu (TSV)
TCB
[24]
Cu/Ni/Sn/Ni/Cu (TSV)
TCB
[24]
Cu/Sn/Cu (TSV)
TCB
[25]
Cu/Sn/Au/Ni/Cu (TSV)
TCB
[25]
Cu/Ni/Sn/Au/Ni/Cu (TSV)
TCB
[25]
50 nm Ti/120 nm Cu/3 µm Cu/3 µm Sn
TCB 260 °C
[26]
10 µm Cu/10 µm SnAg
TCB 250 °C
[27]
Cu/Sn/Cu (TSV)
Reflow
[28]
Cu/Sn/Ni/Cu (TSV)
Reflow
[28]
Cu/Ni/Sn/Ni/Cu (TSV)
Reflow
[28]
(continued)