294
S. Lee
Fig. 10.39 A schematic of
epoxy flux deposited
substrate on TCB bonding
stage
Unit
Underfill or Flux
Stage temp: 140~160°C
Bonding order
Stage temp: 140~160°C
TCB
Fig. 10.40 A schematic of TCB building block: NCF
10.4.3 TCB Assembly Building Block Design
and Development
The flow chart (see Fig. 10.41) illustrates the procedure for process development of the 2.5/3D package, including material characterization and fundamental
investigations.
S. Lee
Fig. 10.39 A schematic of
epoxy flux deposited
substrate on TCB bonding
stage
Unit
Underfill or Flux
Stage temp: 140~160°C
Bonding order
Stage temp: 140~160°C
TCB
Fig. 10.40 A schematic of TCB building block: NCF
10.4.3 TCB Assembly Building Block Design
and Development
The flow chart (see Fig. 10.41) illustrates the procedure for process development of the 2.5/3D package, including material characterization and fundamental
investigations.