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S. Lee
(a)
(b)
(c)
(d)
Filled epoxy
Unfilled epoxy
Fig. 10.33 Schematics of NCF and pre-applied epoxy based materials: (a) filled and unfilled epoxy,
(b) exposed bumps using cavity, (c) exposed bumps, and (d) typical NCF
(a)
(b)
(c)
Void
Overflow contamination
Filler entrapment
Fig. 10.34 Schematics of failures of NCF: (a) NCF voids in lamination process, (b) NCF overflow
contamination in TCB, and (c) filler entrapment on interconnections