10 Fundamentals of Bonding Technology and Process Materials …
265
(a)
(b)
Time
Temperature
Ramp zone
Soak zone
Peak Temp
Time Above Liquidus
Fig. 10.5 Traditional flip chip assembly process: (a) A schematic of assembly process flow and
(b) reflow profile plot
Fig. 10.6 Schematics of TCB using epoxy flux
can accomplish metallurgical interconnects as well as cure the underfill at the same
time. TCB offers apparently simpler set of process steps, but involves more complex
development including process, material formulation, and equipment than that of
conventional flip chip assembly process. The complexity results from simplifying
or combining process steps that may be a compelling solution known to overcome
265
(a)
(b)
Time
Temperature
Ramp zone
Soak zone
Peak Temp
Time Above Liquidus
Fig. 10.5 Traditional flip chip assembly process: (a) A schematic of assembly process flow and
(b) reflow profile plot
Fig. 10.6 Schematics of TCB using epoxy flux
can accomplish metallurgical interconnects as well as cure the underfill at the same
time. TCB offers apparently simpler set of process steps, but involves more complex
development including process, material formulation, and equipment than that of
conventional flip chip assembly process. The complexity results from simplifying
or combining process steps that may be a compelling solution known to overcome