7 Fundamentals and Failures in Die Preparation for 3D Packaging
171
Fig. 7.11 The critical
compressive stress for
buckle-delamination. (Color
figure online) [52]
material control [53]. The side view and top view of thermal sliding process was
given in Fig. 7.13. Wafer 1 is at fixed position. Wafer 2 is moving at velocity v under
load F. The viscosity of the adhesive at the thermoslide temperature is η, and the
thickness of the adhesive is H. Based on viscosity definition, we have
F
A
= η
υ
H
(7.1)
171
Fig. 7.11 The critical
compressive stress for
buckle-delamination. (Color
figure online) [52]
material control [53]. The side view and top view of thermal sliding process was
given in Fig. 7.13. Wafer 1 is at fixed position. Wafer 2 is moving at velocity v under
load F. The viscosity of the adhesive at the thermoslide temperature is η, and the
thickness of the adhesive is H. Based on viscosity definition, we have
F
A
= η
υ
H
(7.1)