Chapter 21
High-Temperature Creep Damage
Evolution of C/SiC Based on Acoustic
Emission
Guodong Bai, Xiaoyan Tong, and Leijiang Yao
Abstract C/SiC ceramic matrix composites are excellent high temperature resistant
materials being light, with high strength and good toughness. It is necessary to understand the evolution of its characteristics before application. In this work, an acoustic
emission (AE) signal is recorded for the creep damage process of C/SiC at high
temperature, and the dual variable voting method and cluster analysis are applied to
get the most suitable parameters for AE signal clustering analysis to provide optimal
clustering. The clustering results of AE events were used to reproduce the evolution
of typical damage, fiber breakage, matrix cracking and interface damage, and to
compare the differences of the acoustic emission signals between different lifetime
C/SiC samples. A relationship between the AE signal and the damage mechanism of
C/SiC is constructed using AE events analysis and SEM observations, and finally the
damage evolution and creep lifetime of C/SiC by pattern recognition is investigated.
The results show that the sample with long creep lifetime has a longer pulled-out
carbon fibers and a larger proportion of interface damage than short one, it is due to
the difference of interface bonding. The interface damage leads to different types of
creep rupture, and dominates the C/SiC high temperature creep lifetime.
21.1 Introduction
Carbon/Silicon Carbide (C/SiC) ceramic matrix composites (CMC) have excellent
high temperature mechanical properties which are of particular use for high temperatures [1–5]. These include high strength and stiffness, and good thermal stability. It
G. Bai (B) · X. Tong · L. Yao
National Key Laboratory of Science and Technology on UAV, Northwestern Polytechnical
University, Xi’an 710072, China
e-mail: baiguodong@vip.qq.com
X. Tong
e-mail: tongxy@nwpu.edu.cn
L. Yao
e-mail: yaolj@nwpu.edu.cn
© The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2021
G. Shen et al. (eds.), Advances in Acoustic Emission Technology, Springer Proceedings
in Physics 259, https://doi.org/10.1007/978-981-15-9837-1_21
235
High-Temperature Creep Damage
Evolution of C/SiC Based on Acoustic
Emission
Guodong Bai, Xiaoyan Tong, and Leijiang Yao
Abstract C/SiC ceramic matrix composites are excellent high temperature resistant
materials being light, with high strength and good toughness. It is necessary to understand the evolution of its characteristics before application. In this work, an acoustic
emission (AE) signal is recorded for the creep damage process of C/SiC at high
temperature, and the dual variable voting method and cluster analysis are applied to
get the most suitable parameters for AE signal clustering analysis to provide optimal
clustering. The clustering results of AE events were used to reproduce the evolution
of typical damage, fiber breakage, matrix cracking and interface damage, and to
compare the differences of the acoustic emission signals between different lifetime
C/SiC samples. A relationship between the AE signal and the damage mechanism of
C/SiC is constructed using AE events analysis and SEM observations, and finally the
damage evolution and creep lifetime of C/SiC by pattern recognition is investigated.
The results show that the sample with long creep lifetime has a longer pulled-out
carbon fibers and a larger proportion of interface damage than short one, it is due to
the difference of interface bonding. The interface damage leads to different types of
creep rupture, and dominates the C/SiC high temperature creep lifetime.
21.1 Introduction
Carbon/Silicon Carbide (C/SiC) ceramic matrix composites (CMC) have excellent
high temperature mechanical properties which are of particular use for high temperatures [1–5]. These include high strength and stiffness, and good thermal stability. It
G. Bai (B) · X. Tong · L. Yao
National Key Laboratory of Science and Technology on UAV, Northwestern Polytechnical
University, Xi’an 710072, China
e-mail: baiguodong@vip.qq.com
X. Tong
e-mail: tongxy@nwpu.edu.cn
L. Yao
e-mail: yaolj@nwpu.edu.cn
© The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2021
G. Shen et al. (eds.), Advances in Acoustic Emission Technology, Springer Proceedings
in Physics 259, https://doi.org/10.1007/978-981-15-9837-1_21
235