References
Amiri, M., & Khonsari, M. M. (2012). On the role of entropy generation in processes involving
fatigue. Entropy, 14(1), 24–31.
Basaran, C., & Chandaroy, R. (2002). Thermomechanical analysis of solder joints under thermal
and vibrational loading. Transactions of ASME Journal of Electronic Packaging, 124(1),
60–67.
Basaran, C., Li, S., & Abdulhamid, M. (2008). Thermomigration induced degradation in solder
alloys. Journal of Applied Physics, 103, 123520.
Basaran, C., & Lin, M. (2007a). Damage mechanics of electromigration in microelectronics copper
interconnects. International Journal of Materials and Structural Integrity, 1(1/2/3), 16–39.
Basaran, C., & Lin, M. (2007b). Electromigration induced strain field simulations for
nanoelectronics lead-free solder joints. International Journal of Solids and Structures, 44,
4909–4924.
Fig. 4.12 Stress–strain diagram of cyclic loading
Fig. 4.13 Thermodynamic State Index evolution for monotonic loading
References
197
Amiri, M., & Khonsari, M. M. (2012). On the role of entropy generation in processes involving
fatigue. Entropy, 14(1), 24–31.
Basaran, C., & Chandaroy, R. (2002). Thermomechanical analysis of solder joints under thermal
and vibrational loading. Transactions of ASME Journal of Electronic Packaging, 124(1),
60–67.
Basaran, C., Li, S., & Abdulhamid, M. (2008). Thermomigration induced degradation in solder
alloys. Journal of Applied Physics, 103, 123520.
Basaran, C., & Lin, M. (2007a). Damage mechanics of electromigration in microelectronics copper
interconnects. International Journal of Materials and Structural Integrity, 1(1/2/3), 16–39.
Basaran, C., & Lin, M. (2007b). Electromigration induced strain field simulations for
nanoelectronics lead-free solder joints. International Journal of Solids and Structures, 44,
4909–4924.
Fig. 4.12 Stress–strain diagram of cyclic loading
Fig. 4.13 Thermodynamic State Index evolution for monotonic loading
References
197