Chapter 15
Methodology for Modeling the Energy
and Material Footprint of Future
Telecommunication Networks
Lutz Stobbe, Nils F. Nissen, Jan Druschke, Hannes Zedel, Nikolai Richter,
and Klaus-Dieter Lang
Abstract This paper presents important methodical aspects in conjunction with the
ongoing development of a novel multi-level-model in support of lifecycle environmental assessments of telecommunication networks. The new approach is, to some
extent, emulating the OSI-layer model (Open Systems Interconnection), starting at
the bottom with the main physical components, followed by product configurations,
network architecture and control. On the top layer, the model scales through application and use case scenarios. This complex inventory model furthermore distinguishes
between constructive (hardware-defined) elements on the one hand and operational
(software-defined) elements on the other. By combining technical data as fixed values
with application data as variable values, it is now possible to analyze the causal
interaction between different technology generations, network configurations, and
utilization intensity. It will allow identifying the best starting point for eco-design
and improvement measures. Due to fact that the new methodology is not limited to
energy consumption only, it supports a holistic understanding of the environmental
impact of telecommunication networks.
Keywords 5G · Inventory · Model · Energy · Material · Footprint
15.1 Motivation
The rapidly evolving mobile network infrastructure is a key element for digitization
in modern societies. There is an enormous demand by private and industrial users
worldwide for the highest possible traffic capacity (eMBB), low latency (uRLLC),
and network coverage (mMTC) (see Fig. 15.1).
L. Stobbe (B) · N. F. Nissen · J. Druschke · H. Zedel · N. Richter
Environmental and Reliability Engineering, Fraunhofer Institute for Reliability
and Microintegration (IZM), Berlin, Germany
e-mail: lutz.stobbe@izm.fraunhofer.de
K.-D. Lang
Technical University Berlin, Berlin, Germany
© Springer Nature Singapore Pte Ltd. 2021
Y. Kishita et al. (eds.), EcoDesign and Sustainability II, Sustainable Production, Life
Cycle Engineering and Management, https://doi.org/10.1007/978-981-15-6775-9_15
223
Methodology for Modeling the Energy
and Material Footprint of Future
Telecommunication Networks
Lutz Stobbe, Nils F. Nissen, Jan Druschke, Hannes Zedel, Nikolai Richter,
and Klaus-Dieter Lang
Abstract This paper presents important methodical aspects in conjunction with the
ongoing development of a novel multi-level-model in support of lifecycle environmental assessments of telecommunication networks. The new approach is, to some
extent, emulating the OSI-layer model (Open Systems Interconnection), starting at
the bottom with the main physical components, followed by product configurations,
network architecture and control. On the top layer, the model scales through application and use case scenarios. This complex inventory model furthermore distinguishes
between constructive (hardware-defined) elements on the one hand and operational
(software-defined) elements on the other. By combining technical data as fixed values
with application data as variable values, it is now possible to analyze the causal
interaction between different technology generations, network configurations, and
utilization intensity. It will allow identifying the best starting point for eco-design
and improvement measures. Due to fact that the new methodology is not limited to
energy consumption only, it supports a holistic understanding of the environmental
impact of telecommunication networks.
Keywords 5G · Inventory · Model · Energy · Material · Footprint
15.1 Motivation
The rapidly evolving mobile network infrastructure is a key element for digitization
in modern societies. There is an enormous demand by private and industrial users
worldwide for the highest possible traffic capacity (eMBB), low latency (uRLLC),
and network coverage (mMTC) (see Fig. 15.1).
L. Stobbe (B) · N. F. Nissen · J. Druschke · H. Zedel · N. Richter
Environmental and Reliability Engineering, Fraunhofer Institute for Reliability
and Microintegration (IZM), Berlin, Germany
e-mail: lutz.stobbe@izm.fraunhofer.de
K.-D. Lang
Technical University Berlin, Berlin, Germany
© Springer Nature Singapore Pte Ltd. 2021
Y. Kishita et al. (eds.), EcoDesign and Sustainability II, Sustainable Production, Life
Cycle Engineering and Management, https://doi.org/10.1007/978-981-15-6775-9_15
223