1 Introduction to Laser Micro-to-Nano Manufacturing
71
183. T.-B. Song, Y. Chen, C.-H. Chung, Y. Yang, B. Bob, H.-S. Duan, G. Li, K.-N. Tu, Y. Huang,
Y. Yang, Nanoscale joule heating and electromigration enhanced ripening of silver nanowire
contacts. ACS Nano 8, 2804–2811 (2014)
184. A.T. Bellew, H.G. Manning, C. Gomes da Rocha, M.S. Ferreira, J.J. Boland, Resistance of
single Ag nanowire junctions and their role in the conductivity of nanowire networks. ACS
Nano 9, 11422–11429 (2015)
185. A. Vafaei, A. Hu, I.A. Goldthorpe, Joining of individual silver nanowires via electrical current.
Nano-Micro Lett. 6, 293–300 (2014)
186. Y. Akada, H. Tatsumi, T. Yamaguchi, A. Hirose, T. Morita, E. Ide, Interfacial bonding mechanism using silver metallo-organic nanoparticles to bulk metals and observation of sintering
behavior. Mater. Trans. 49, 1537–1545 (2008)
187. H. Alarifi, A. Hu, M. Yavuz, Y.N. Zhou, Silver nanoparticle paste for low-temperature bonding
of copper. J. Electron. Mater. 40, 1394–1402 (2011)
188. J.S. Oh, J.S. Oh, J.H. Shin, G.Y. Yeom, K.N. Kim, Nano-welding of Ag nanowires using rapid
thermal annealing for transparent conductive films. J. Nanosci. Nanotechnol. 15, 8647–8651
(2015)
189. Ç.Ö. Girit, A. Zettl, Soldering to a single atomic layer. Appl. Phys. Lett. 91, 193512 (2007)
190. Y. Peng, T. Cullis, B. Inkson, Bottom-up nanoconstruction by the welding of individual
metallic nanoobjects using nanoscale solder. Nano Lett. 9, 91–96 (2009)
191. Q. Cui, F. Gao, S. Mukherjee, Z. Gu, Joining and interconnect formation of nanowires and
carbon nanotubes for nanoelectronics and nanosystems. Small 5, 1246–1257 (2009)
192. Y. Ma, H. Li, L. Yang, A. Hu, Reaction-assisted diffusion bonding of Ti 6 A l4 V alloys with
Ti/Ni nanostructured multilayers. J. Mater. Process. Technol. 262, 204–209 (2018)
193. Mafune, J. Am. Chem. Soc. 125, 1636 (2003)
194. C. Ma, S. Xue, D. Bridges, Z. Palmer, Z. Feng, A. Hu, Low temperature brazing nickel with
Ag nanoparticle and Cu-Ag core-shell nanowire nanopastes. J. Alloys Compd. 721, 431–439
(2017)
195. D. Bridges, R. Xu, A. Hu, Microstructure and mechanical properties of Ni nanoparticlebonded Inconel 718. Mater. Des. 174, 107784 (2019)
196. S. Dai, Q. Li, G. Liu, H. Yang, Y. Yang, D. Zhao, W. Wang, M. Qiu, Laser-induced single
point nanowelding of silver nanowires. Appl. Phys. Lett. 108, 121103 (2016)
197. L. Lin, G. Zou, L. Liu, W.W. Duley, Y.N. Zhou, Plasmonic engineering of metal-oxide
nanowire heterojunctions in integrated nanowire rectification units. Appl. Phys. Lett. 108,
203107 (2016)
198. Y. Deng, Y. Bai, Y. Yu, S. Deng, Y. Tian, G. Zhang, C. Zheng, J. Wu, A. Hu, Laser nanojoining
of copper nanowires. J. Laser Appl. 31, 022414 (2019)
199. M. Terrones, F. Banhart, N. Grobert, J.C. Charlier, H. Terrones, P.M. Ajayan, Molecular
junctions by joining single-walled carbon nanotubes. Phys. Rev. Lett. 89, 075505 (2002)
200. H. Shehla, A. Ishaq, Y. Khan, I. Javed, R. Saira, N. Shahzad, M. Maaza, Ion beam irradiationinduced nano-welding of Ag nanowires. Micro Nano Lett. 11, 34–37 (2016)
201. C. Chen, L. Yan, E.S.-W. Kong, Y. Zhang, Ultrasonic nanowelding of carbon nanotubes to
metal electrodes. Nanotechnology 17, 2192–2197 (2006)
202. S. Hausner, S. Weis, B. Wielage, G. Wagner, Low temperature joining of copper by Ag
nanopaste: correlation of mechanical properties and process parameters. Welding World 60,
1277–1286 (2016)
203. G. Satoh, C. Qiu, S. Naveed, Y. Lawrence Yao, Strength and phase identification of autogenous
laser brazed dissimilar metal microjoints. J. Manuf. Sci. Eng. 137 (2015)
204. S.J. Henley, M. Cann, I. Jurewicz, A. Dalton, D. Milne, Laser patterning of transparent
conductive metal nanowire coatings: simulation and experiment. Nanoscale 6, 946–952 (2014)
205. H. Yang, J. Lu, P. Ghosh, Z. Chen, W. Wang, H. Ye, Q. Yu, M. Qiu, Q. Li, Plasmonic-enhanced
targeted nanohealing of metallic nanostructures. Appl. Phys. Lett. 112, 071108 (2018)
206. Y. Li, Y. Li, L. Feng, G. Lu, Metal alloy nanowire joining induced by femtosecond laser
heating: A hybrid atomistic-continuum interpretation. Int. J. Heat Mass Transfer 150, 119287
(2020)
71
183. T.-B. Song, Y. Chen, C.-H. Chung, Y. Yang, B. Bob, H.-S. Duan, G. Li, K.-N. Tu, Y. Huang,
Y. Yang, Nanoscale joule heating and electromigration enhanced ripening of silver nanowire
contacts. ACS Nano 8, 2804–2811 (2014)
184. A.T. Bellew, H.G. Manning, C. Gomes da Rocha, M.S. Ferreira, J.J. Boland, Resistance of
single Ag nanowire junctions and their role in the conductivity of nanowire networks. ACS
Nano 9, 11422–11429 (2015)
185. A. Vafaei, A. Hu, I.A. Goldthorpe, Joining of individual silver nanowires via electrical current.
Nano-Micro Lett. 6, 293–300 (2014)
186. Y. Akada, H. Tatsumi, T. Yamaguchi, A. Hirose, T. Morita, E. Ide, Interfacial bonding mechanism using silver metallo-organic nanoparticles to bulk metals and observation of sintering
behavior. Mater. Trans. 49, 1537–1545 (2008)
187. H. Alarifi, A. Hu, M. Yavuz, Y.N. Zhou, Silver nanoparticle paste for low-temperature bonding
of copper. J. Electron. Mater. 40, 1394–1402 (2011)
188. J.S. Oh, J.S. Oh, J.H. Shin, G.Y. Yeom, K.N. Kim, Nano-welding of Ag nanowires using rapid
thermal annealing for transparent conductive films. J. Nanosci. Nanotechnol. 15, 8647–8651
(2015)
189. Ç.Ö. Girit, A. Zettl, Soldering to a single atomic layer. Appl. Phys. Lett. 91, 193512 (2007)
190. Y. Peng, T. Cullis, B. Inkson, Bottom-up nanoconstruction by the welding of individual
metallic nanoobjects using nanoscale solder. Nano Lett. 9, 91–96 (2009)
191. Q. Cui, F. Gao, S. Mukherjee, Z. Gu, Joining and interconnect formation of nanowires and
carbon nanotubes for nanoelectronics and nanosystems. Small 5, 1246–1257 (2009)
192. Y. Ma, H. Li, L. Yang, A. Hu, Reaction-assisted diffusion bonding of Ti 6 A l4 V alloys with
Ti/Ni nanostructured multilayers. J. Mater. Process. Technol. 262, 204–209 (2018)
193. Mafune, J. Am. Chem. Soc. 125, 1636 (2003)
194. C. Ma, S. Xue, D. Bridges, Z. Palmer, Z. Feng, A. Hu, Low temperature brazing nickel with
Ag nanoparticle and Cu-Ag core-shell nanowire nanopastes. J. Alloys Compd. 721, 431–439
(2017)
195. D. Bridges, R. Xu, A. Hu, Microstructure and mechanical properties of Ni nanoparticlebonded Inconel 718. Mater. Des. 174, 107784 (2019)
196. S. Dai, Q. Li, G. Liu, H. Yang, Y. Yang, D. Zhao, W. Wang, M. Qiu, Laser-induced single
point nanowelding of silver nanowires. Appl. Phys. Lett. 108, 121103 (2016)
197. L. Lin, G. Zou, L. Liu, W.W. Duley, Y.N. Zhou, Plasmonic engineering of metal-oxide
nanowire heterojunctions in integrated nanowire rectification units. Appl. Phys. Lett. 108,
203107 (2016)
198. Y. Deng, Y. Bai, Y. Yu, S. Deng, Y. Tian, G. Zhang, C. Zheng, J. Wu, A. Hu, Laser nanojoining
of copper nanowires. J. Laser Appl. 31, 022414 (2019)
199. M. Terrones, F. Banhart, N. Grobert, J.C. Charlier, H. Terrones, P.M. Ajayan, Molecular
junctions by joining single-walled carbon nanotubes. Phys. Rev. Lett. 89, 075505 (2002)
200. H. Shehla, A. Ishaq, Y. Khan, I. Javed, R. Saira, N. Shahzad, M. Maaza, Ion beam irradiationinduced nano-welding of Ag nanowires. Micro Nano Lett. 11, 34–37 (2016)
201. C. Chen, L. Yan, E.S.-W. Kong, Y. Zhang, Ultrasonic nanowelding of carbon nanotubes to
metal electrodes. Nanotechnology 17, 2192–2197 (2006)
202. S. Hausner, S. Weis, B. Wielage, G. Wagner, Low temperature joining of copper by Ag
nanopaste: correlation of mechanical properties and process parameters. Welding World 60,
1277–1286 (2016)
203. G. Satoh, C. Qiu, S. Naveed, Y. Lawrence Yao, Strength and phase identification of autogenous
laser brazed dissimilar metal microjoints. J. Manuf. Sci. Eng. 137 (2015)
204. S.J. Henley, M. Cann, I. Jurewicz, A. Dalton, D. Milne, Laser patterning of transparent
conductive metal nanowire coatings: simulation and experiment. Nanoscale 6, 946–952 (2014)
205. H. Yang, J. Lu, P. Ghosh, Z. Chen, W. Wang, H. Ye, Q. Yu, M. Qiu, Q. Li, Plasmonic-enhanced
targeted nanohealing of metallic nanostructures. Appl. Phys. Lett. 112, 071108 (2018)
206. Y. Li, Y. Li, L. Feng, G. Lu, Metal alloy nanowire joining induced by femtosecond laser
heating: A hybrid atomistic-continuum interpretation. Int. J. Heat Mass Transfer 150, 119287
(2020)