355
Index

S
Scanning electron microscopy (SEM),

277, 304, 306

Sealants

curable polymer, 193

overview, 192–193

process, 193

safety issues, 193

types, 193

Separators

description, 189

function, 189

materials use, 189–190

Series resistor-inductor-capacitor
circuits, 28, 30

Silicon nanospheres, 155

Simulink, 264

Solid state polymer electrolytes, 185,

188–189

Spectroscopy, AC impedance, 65

Supercapacitor stacking

applications, 89

parallel stacking, 90–91

series stacking, 89–90

Supercapacitor-battery-fuel cell

(ES-B-FC) systems, 268

Supercapacitors, electrochemical
double-layer; see
Electrochemical double-layer
supercapacitors
T
Tank circuits, 25

Teflon, 135, 136

Tetraethylammonium tetrafluoroborate

(Et4NBF4), 204

Thales of Miletus, 1

Tin, 167

Titanium, 171

Titanium nitride, 172

Topology 5, 268, 269

Transition metal nitrides, 171–173, 339.

See also specific metal materials

Transition metal oxides, 167–169, 171. See
also specific metal oxides

Transmission electron microscopy

(TEM), 277, 306–307

Tuner capacitors, 33

U
Underpotential deposition (UPD),

108–109

Unmanned aerial vehicles (UAVs), 331

V

Vanadium, 167, 171

Vanadium nitride, 172

Variable capacitors, 32–33

Voltage cell balancing, electrochemical

supercapacitors

active balancing, 221

overview, 219

resistance balancing, 220–221

Zenor diode balancing, 220, 221

X

X-ray diffraction (XRD), 277, 307–308
X-ray photoelectron spectroscopy (XPS),
277, 308–309
Z
Zenor diode balancing, 220, 221

Zeolite templated carbons, 154