Table 4.39
Releases for semiconductor manufacturing facilities (SIC 3674) in TRI, by number of facilities (releases reported in pounds/year)
Chemical name
# Facilities reporting
chemical
Fugitive
air
Point air
Water
discharges
Under-ground
injection
Land
disposal
Total
releases
Average releases
per facility
Sulfuric acid
125
13544
88209
17
250
139
102259
818
Hydrochloric acid
78
8262
69429
3
0
10
77704
996
Hydrogen
fluoride
71
4940
55479
9902
0
5
70326
991
Phosphoric acid
69
4039
25674
0
0
5
29718
431
Nitric acid
57
5403
47628
23
0
5
53059
931
Acetone
53
121794
890290
1460
659
5
1014208
19136
Ammonia
42
42770
101717
42082
17805
8600
212974
5071
Glycol ethers
27
41317
212900
500
0
82000
336717
12471
Xylene (mixed isomers) 25
9952
252661
0
139
0
262752
10510
Ethylene glycol
16
1688
9316
1600
0
0
12604
788
Methanol
16
31049
135566
0
129
0
166744
10422
Freon 113
10
41211
73335
0
0
0
114546
11455
1,1,1-Trichloroethane
8
1691
82366
0
1
0
84058
10507
Methyl ethyl ketone
6
1332
128250
0
0
5
129587
21598
Tetrachloroethylene
4
514
55034
1
0
0
55549
13887
Ammonium nitrate
(solution)
3
0
0
0
0
0
0
0
Ammonium sulfate
(solution)
3
250
0
0
0
0
250
83
Lead
3
0
0
0
0
0
0
0
Phenol
3
50
2745
0
0
0
2795
932
Toluene
3
25170
33580
0
0
0
58750
19583
Trichloroethylene
3
14009
21896
0
0
0
35905
11968
Copper
2
0
0
12
0
0
12
6
Ethylbenzene
2
175
1300
0
0
0
1475
738
172
O. S. Amuda et al.