Effect of Number of Passes and Pass
Directions in Friction Stir Processing
of Copper
Nisarg Patel, Farhan Khimani, and Vishvesh J. Badheka
Abstract This project involves the use of friction stir processing with a change in the
number of passes on grain refinement of pure copper. FSP is a rising metal processing
technique for manufacturing fine-grained structures. The project’s main goal was to
determine the outcome of change in the number of passes and pass direction on
the grain size and microstructure. The change in microstructure is accompanied by
changes in properties like grain structure, tensile strength, and hardness. FSP has
been done on 3-mm-thick pure copper plates, using a tungsten carbide tool of 18 mm
diameter shoulder with a tapered pin of diameter 3 mm, a tool rotation speed of
1500 rpm, 2° tilt angle and tool traverse speed of 20 mm/min with the variable
being the number of passes and pass direction. The optical microscopy, grain size
measurements of the nugget region, and time–temperature plot is presented. The
specimen with smaller grain sizes are further tested for tensile strength.
Keywords Friction stir processing · Surface processing · Copper · Grain size
1 Introduction
Copper has very high thermal and electrical conductivity, high resistance to corrosion and oxidation. These properties are the reason why copper is one of the most
commonly used industrial metals with numerous applications in thermal, electrical,
and electronics sectors, i.e., electrical wiring, cables, electrodes, and heat exchangers.
N. Patel · F. Khimani · V. J. Badheka (B)
Department of Mechanical Engineering, School of Technology, Pandit Deendayal Petroleum
University, Gandhinagar 382007, India
e-mail: Vishvesh.Badheka@spt.pdpu.ac.in
N. Patel
e-mail: Nisargpatel117@gmail.com
F. Khimani
e-mail: Farhankhimani123@gmail.com
© The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2021
A. K. Parwani et al. (eds.), Recent Advances in Mechanical Infrastructure,
Lecture Notes in Intelligent Transportation and Infrastructure,
https://doi.org/10.1007/978-981-33-4176-0_17
211
Directions in Friction Stir Processing
of Copper
Nisarg Patel, Farhan Khimani, and Vishvesh J. Badheka
Abstract This project involves the use of friction stir processing with a change in the
number of passes on grain refinement of pure copper. FSP is a rising metal processing
technique for manufacturing fine-grained structures. The project’s main goal was to
determine the outcome of change in the number of passes and pass direction on
the grain size and microstructure. The change in microstructure is accompanied by
changes in properties like grain structure, tensile strength, and hardness. FSP has
been done on 3-mm-thick pure copper plates, using a tungsten carbide tool of 18 mm
diameter shoulder with a tapered pin of diameter 3 mm, a tool rotation speed of
1500 rpm, 2° tilt angle and tool traverse speed of 20 mm/min with the variable
being the number of passes and pass direction. The optical microscopy, grain size
measurements of the nugget region, and time–temperature plot is presented. The
specimen with smaller grain sizes are further tested for tensile strength.
Keywords Friction stir processing · Surface processing · Copper · Grain size
1 Introduction
Copper has very high thermal and electrical conductivity, high resistance to corrosion and oxidation. These properties are the reason why copper is one of the most
commonly used industrial metals with numerous applications in thermal, electrical,
and electronics sectors, i.e., electrical wiring, cables, electrodes, and heat exchangers.
N. Patel · F. Khimani · V. J. Badheka (B)
Department of Mechanical Engineering, School of Technology, Pandit Deendayal Petroleum
University, Gandhinagar 382007, India
e-mail: Vishvesh.Badheka@spt.pdpu.ac.in
N. Patel
e-mail: Nisargpatel117@gmail.com
F. Khimani
e-mail: Farhankhimani123@gmail.com
© The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2021
A. K. Parwani et al. (eds.), Recent Advances in Mechanical Infrastructure,
Lecture Notes in Intelligent Transportation and Infrastructure,
https://doi.org/10.1007/978-981-33-4176-0_17
211