18 Fault Isolation and Failure Analysis of 3D Packaging
585
Fig. 18.10 (a) SSM analysis
of a short failure in a 3D
package with stacked die
configuration. X and Y
location of the short can be
determined by the current
analysis. (b), (c) Z
dimension analysis of the
current path location shown
in (a). The distance between
the minimum and maximum
magnetic field along the
green line in (a) is measured
as 1906 μm. The distance
between the sample surface
and the failure location is
then estimated to be 560 μm,
by subtracting the sensor to
sample distance (393 μm)
from the sensor to current
path distance (953 μm, half
of 1906 μm) (Adapted from
Ref. [16])
short defects nearby in the same failing structure could also be inaccurate. In these
cases, SSM could be an alternative method to effectively identify three dimensional
locations of defects.
585
Fig. 18.10 (a) SSM analysis
of a short failure in a 3D
package with stacked die
configuration. X and Y
location of the short can be
determined by the current
analysis. (b), (c) Z
dimension analysis of the
current path location shown
in (a). The distance between
the minimum and maximum
magnetic field along the
green line in (a) is measured
as 1906 μm. The distance
between the sample surface
and the failure location is
then estimated to be 560 μm,
by subtracting the sensor to
sample distance (393 μm)
from the sensor to current
path distance (953 μm, half
of 1906 μm) (Adapted from
Ref. [16])
short defects nearby in the same failing structure could also be inaccurate. In these
cases, SSM could be an alternative method to effectively identify three dimensional
locations of defects.