15 Die and Package Level Thermal and Thermal/Moisture Stresses …
467
Acknowledgements The editors would like to thank Zhiheng Huang from Sun Yat-sen University
for his critical review of this Chapter.
References
1. Z. Wang, J. Microelectromech. Syst. 24, 1211 (2015)
2. J.U. Knickerbocker et al., IBM J. Res. Dev. 52, 553 (2008)
3. P. Garrou, C. Bower, P. Ramm, in Handbook of 3D integration (Wiley, 2008)
4. M. Jung, J. Mitra, D.Z. Pan, S.K. Lim, Commun. ACM 57, 107 (2014)
5. JEDEC-JEP158, (JEDEC Solid State Technology Association, 2009)
6. S.W. Yoon, J.H. Ku, F. Carson, SEMICON Korea 2010 (Seoul, Korean, 2010)
7. K.N. Tu, Microelectron. Reliab. 51, 517 (2011)
8. C.-H. Liu, J.-L. Tsai, C. Hung-Hsien, C.-L. Lu, S.-C. Chen, in IEEE 64th Electronic
Components and Technology Conference (2014), p. 1628
9. K. Sakuma et al., in IEEE 64th Electronic Components and Technology Conference (ECTC)
(2014), p. 647
10. L. Mirkarimi, R. Zhang, A. Agrawal, H. Shaba, B.-S. Lee, R. Katkar, E. Chau, S. Arkalgud
(2014)
11. C.-H. Liu, Y.-H. Liao, W.-T. Chen, C.-L. Lu, and S.-C. Chen, in IEEE 65th Electronic
Components and Technology Conference (ECTC) (2015), p. 1502
12. K. Sakuma et al., in IEEE 65th Electronic Components and Technology Conference (ECTC)
(2015), p. 318
13. S.Y. Yang, W.-S. Kwon, S.-B. Lee, Microelectron. Reliab. 52, 718 (2012)
14. X.J. Fan, E. Suhir, Moisture Sensitivity of Plastic Packages of IC Devices (Springer, New York,
2010)
15. X.J. Fan, T.B. Lim, in ASME International Mechanical Engineering Congress and Exposition,
IMECE/EPE-14 (1999)
16. J. Zhou, T.Y. Tee, X.J. Fan, in Moisture Sensitivity of Plastic Packages of IC Devices (Springer,
2010), p. 153
17. X.J. Fan, J.-H. Zhao, in 12th International Conference on Thermal, Mechanical and MultiPhysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (2011),
p. 1
18. X.Q. Shi, Y.L. Zhang, Z. Wei, X.J. Fan, IEEE Trans. Compon. Packag. Technol. 31, 94 (2008)
19. A.M.N. Kitano, S. Kawai, in Proceedings of IRPS (1988), p. 90
20. C.G. Shirley, IEEE Trans. Device Mater. Reliab. 14, 426 (2014)
21. B. Xie, X.Q. Shi, X.J. Fan, in Proceedings of 57th Electronic Components and Technology
Conference (2007), p. 242
22. B. Xie, X.J. Fan, X. Shi, H. Ding, ASME J. Electron. Packag. 131, 031011 (2009)
23. B. Xie, X.J. Fan, X. Shi, H. Ding, ASME J. Electron. Packag. 131, 031010 (2009)
24. E.H. Wong, Y.C. Teo, T.B. Lim, in Proceedings of Electronic Components and Technology
Conference (1998), p. 1372
25. S. Liu, Y. Mei, IEEE Trans. Compon. Packag. Manuf. Technol. Part A: 18, 634 (1995)
26. X.J. Fan, J. Zhou, A. Chandra, in 58th Electronic Components and Technology Conference
(2008), p. 1054
27. X.J. Fan, G.Q. Zhang, W.D. van Driel, L.J. Ernst, IEEE Trans. Compon. Packag. Technol. 31,
252 (2008)
28. J.V. Olmen et al., Microelectron. Eng. 88, 745 (2011)
29. K. Sinwoo et al., in IEEE International 3D Systems Integration Conference (3DIC) (2011),
p. 1
30. A. Mercha et al., in IEEE International Electron Devices Meeting (IEDM) (2010), p. 2.2.1
467
Acknowledgements The editors would like to thank Zhiheng Huang from Sun Yat-sen University
for his critical review of this Chapter.
References
1. Z. Wang, J. Microelectromech. Syst. 24, 1211 (2015)
2. J.U. Knickerbocker et al., IBM J. Res. Dev. 52, 553 (2008)
3. P. Garrou, C. Bower, P. Ramm, in Handbook of 3D integration (Wiley, 2008)
4. M. Jung, J. Mitra, D.Z. Pan, S.K. Lim, Commun. ACM 57, 107 (2014)
5. JEDEC-JEP158, (JEDEC Solid State Technology Association, 2009)
6. S.W. Yoon, J.H. Ku, F. Carson, SEMICON Korea 2010 (Seoul, Korean, 2010)
7. K.N. Tu, Microelectron. Reliab. 51, 517 (2011)
8. C.-H. Liu, J.-L. Tsai, C. Hung-Hsien, C.-L. Lu, S.-C. Chen, in IEEE 64th Electronic
Components and Technology Conference (2014), p. 1628
9. K. Sakuma et al., in IEEE 64th Electronic Components and Technology Conference (ECTC)
(2014), p. 647
10. L. Mirkarimi, R. Zhang, A. Agrawal, H. Shaba, B.-S. Lee, R. Katkar, E. Chau, S. Arkalgud
(2014)
11. C.-H. Liu, Y.-H. Liao, W.-T. Chen, C.-L. Lu, and S.-C. Chen, in IEEE 65th Electronic
Components and Technology Conference (ECTC) (2015), p. 1502
12. K. Sakuma et al., in IEEE 65th Electronic Components and Technology Conference (ECTC)
(2015), p. 318
13. S.Y. Yang, W.-S. Kwon, S.-B. Lee, Microelectron. Reliab. 52, 718 (2012)
14. X.J. Fan, E. Suhir, Moisture Sensitivity of Plastic Packages of IC Devices (Springer, New York,
2010)
15. X.J. Fan, T.B. Lim, in ASME International Mechanical Engineering Congress and Exposition,
IMECE/EPE-14 (1999)
16. J. Zhou, T.Y. Tee, X.J. Fan, in Moisture Sensitivity of Plastic Packages of IC Devices (Springer,
2010), p. 153
17. X.J. Fan, J.-H. Zhao, in 12th International Conference on Thermal, Mechanical and MultiPhysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (2011),
p. 1
18. X.Q. Shi, Y.L. Zhang, Z. Wei, X.J. Fan, IEEE Trans. Compon. Packag. Technol. 31, 94 (2008)
19. A.M.N. Kitano, S. Kawai, in Proceedings of IRPS (1988), p. 90
20. C.G. Shirley, IEEE Trans. Device Mater. Reliab. 14, 426 (2014)
21. B. Xie, X.Q. Shi, X.J. Fan, in Proceedings of 57th Electronic Components and Technology
Conference (2007), p. 242
22. B. Xie, X.J. Fan, X. Shi, H. Ding, ASME J. Electron. Packag. 131, 031011 (2009)
23. B. Xie, X.J. Fan, X. Shi, H. Ding, ASME J. Electron. Packag. 131, 031010 (2009)
24. E.H. Wong, Y.C. Teo, T.B. Lim, in Proceedings of Electronic Components and Technology
Conference (1998), p. 1372
25. S. Liu, Y. Mei, IEEE Trans. Compon. Packag. Manuf. Technol. Part A: 18, 634 (1995)
26. X.J. Fan, J. Zhou, A. Chandra, in 58th Electronic Components and Technology Conference
(2008), p. 1054
27. X.J. Fan, G.Q. Zhang, W.D. van Driel, L.J. Ernst, IEEE Trans. Compon. Packag. Technol. 31,
252 (2008)
28. J.V. Olmen et al., Microelectron. Eng. 88, 745 (2011)
29. K. Sinwoo et al., in IEEE International 3D Systems Integration Conference (3DIC) (2011),
p. 1
30. A. Mercha et al., in IEEE International Electron Devices Meeting (IEDM) (2010), p. 2.2.1