360
P. Liu
Fig. 12.11 Sn protrusions on hot end and voids on cold end are observed in flip chip solder joint
under thermal gradient [39]
Fig. 12.12 No sign of Sn migration is observed in a micro bump under thermal gradient. Ni and
Ag migration can be seen from hot end to cold end [39]
P. Liu
Fig. 12.11 Sn protrusions on hot end and voids on cold end are observed in flip chip solder joint
under thermal gradient [39]
Fig. 12.12 No sign of Sn migration is observed in a micro bump under thermal gradient. Ni and
Ag migration can be seen from hot end to cold end [39]