Chapter 17
Cluster Analysis of Acoustic Emission
Signals on Tensile Damage Process
of C/SiC Using an Improved K-Means
Algorithm
Yongzhen Zhang, Xiaoyan Tong, and Leijiang Yao
Abstract C/SiC is one of most important thermal-structural materials for future
aeronautical applications, but there is no consensus on the damage mechanism and
pattern of it. To identify the failure processes under mechanical load is important to
evaluate this material. In this paper, acoustic emission (AE), an effective continuous
damage monitoring technique, is used to monitor tensile tests of 2D-C/SiC. An
unsupervised clustering method based on the deep fusion of a genetic algorithm
and a K-means algorithm is proposed to analyze the AE signals. Pattern recognition
analysis of AE data was carried out to describe the evolution of various damage
mechanisms during the failure process. According to the features of each class and
associated SEM images of the fracture surfaces, a match between AE clusters and
fracture mechanisms involved in the process, including matrix cracking, interface
failure, interlaminar delamination, fiber breakage and bundle breakage, is established.
It is found that the damage evolution of 2D-C/SiC under tensile loading can be
divided into four stages at room temperature. The first stage and the third stage are
the main development stages of matrix cracking and interface damage. The second
stage and the fourth stage are the main damage periods of fiber, fiber bundle and
interlaminar delamination. The damage pattern recognition and damage evolution
process of 2D-C/SiC composites during tensile test are described.
Y. Zhang · X. Tong · L. Yao (B)
National Key Laboratory of Science and Technology on UAV, Northwestern Polytechnical
University, Xi’an 710072, China
e-mail: yaolj@nwpu.edu.cn
Y. Zhang
e-mail: zhangyongzhennpu@163.com
X. Tong
e-mail: tongxy@nwpu.edu.cn
© The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2021
G. Shen et al. (eds.), Advances in Acoustic Emission Technology, Springer Proceedings
in Physics 259, https://doi.org/10.1007/978-981-15-9837-1_17
185
Cluster Analysis of Acoustic Emission
Signals on Tensile Damage Process
of C/SiC Using an Improved K-Means
Algorithm
Yongzhen Zhang, Xiaoyan Tong, and Leijiang Yao
Abstract C/SiC is one of most important thermal-structural materials for future
aeronautical applications, but there is no consensus on the damage mechanism and
pattern of it. To identify the failure processes under mechanical load is important to
evaluate this material. In this paper, acoustic emission (AE), an effective continuous
damage monitoring technique, is used to monitor tensile tests of 2D-C/SiC. An
unsupervised clustering method based on the deep fusion of a genetic algorithm
and a K-means algorithm is proposed to analyze the AE signals. Pattern recognition
analysis of AE data was carried out to describe the evolution of various damage
mechanisms during the failure process. According to the features of each class and
associated SEM images of the fracture surfaces, a match between AE clusters and
fracture mechanisms involved in the process, including matrix cracking, interface
failure, interlaminar delamination, fiber breakage and bundle breakage, is established.
It is found that the damage evolution of 2D-C/SiC under tensile loading can be
divided into four stages at room temperature. The first stage and the third stage are
the main development stages of matrix cracking and interface damage. The second
stage and the fourth stage are the main damage periods of fiber, fiber bundle and
interlaminar delamination. The damage pattern recognition and damage evolution
process of 2D-C/SiC composites during tensile test are described.
Y. Zhang · X. Tong · L. Yao (B)
National Key Laboratory of Science and Technology on UAV, Northwestern Polytechnical
University, Xi’an 710072, China
e-mail: yaolj@nwpu.edu.cn
Y. Zhang
e-mail: zhangyongzhennpu@163.com
X. Tong
e-mail: tongxy@nwpu.edu.cn
© The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2021
G. Shen et al. (eds.), Advances in Acoustic Emission Technology, Springer Proceedings
in Physics 259, https://doi.org/10.1007/978-981-15-9837-1_17
185