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Remanufacturing and Advanced Machining
has shown a high cutting performance, especially a reduced cutting force and lower
temperature when grinding difficult-to-cut materials, such as carbides, optical glass,
ceramics, aluminum alloys, and stone (Huang et al., 2021). There are also reports on
the fabrication of a binderless diamond grinding wheel (BDGW) intended to prevent
impurities from embedding during the machining of soft and brittle materials. The
“binder” features, as well as the “grains,” were produced on a single piece of chemical vapor deposition diamond, while the “grains” were ablated with a femtosecond
laser (Qu et al., 2020).
Highly wear-resistant diamond grinding tools enable machining of virtually all
structural materials with minimal expenses, high accuracy of shapes and sizes, and
low roughness of machined surfaces (Ivanova et al., 2018). Diamond grinding and
sharpening are particularly suitable for the restoration of worn cutting tools, like
axial hard-alloy mills (Vasil’ev and Popov, 2015).
In the last two decades, diamond has been recognized as an alternative to various other available abrasive materials for grinding and finishing processes (Shekhar
and Yadav, 2020). Thus, diamond grinding appears to be one of the most promising machining methods with good prospects. Nevertheless, grinding of cemented
carbides based on titanium carbide (TiC) or titanium carbide–nitride (TiCN) with
nickel and molybdenum matrix, with no additions of tungsten, is still very difficult
even using diamond grinding wheels with Bakelite or metallic binders both in conventional and electrolytic conditions. The process is characterized by large cutting
forces and specific work of grinding, increased specific output, and low efficiency.
Interesting investigations were performed on the material removal mechanism of
TiC/Ni cermet, including the diamond scratching test and the grinding-induced surface damage mechanics (Zhu et al., 2021). The results demonstrated that the material removal experienced plastic deformation, plowing, and fracture in the dynamic
scratching process, where the material microstructure played a determining role in
obtaining surface characteristics of the TiC/Ni cermet. To achieve a smooth surface
and ductile material removal by the ultra-precision grinding process, dislodgement
of hard TiC particles and surface relief formation were induced by varying the material removal rate between the binding phases and the TiC hard particle under the
scratching of the diamond grits. This way, by varying machining parameters, nanometric surface characteristics were formed.
Most studies like the one by Zhu et al. (2021) are based on experimental research
involving numerous variables with different methodologies, posing difficulties to
comparative analysis of results. Theoretical models and simulations also provide
limited insight into these phenomena and help to solve some particular technical
problems. For instance, Habrat (2016) presented selected results of research in the
field of grinding cemented carbide with the use of two different types of diamond
grinding wheels during grinding of the ductile cemented carbide CTS20D workpiece material. The grinding speed, depth of cut, and feed rate were considered as
input process parameters, and the ANOVA (analysis of variance) was employed to
check the results for the developed model. It turned out the application of a resin
bond grinding wheel provided significantly lower grinding force components during
the process. On the other hand, Zhang and Xu (2019) proposed an integrated model
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