2.13 Behaviour of Metals During Anodic Polarization
53
passive layer does certainly not correspond to the ratio of these elements in the bulk
alloy. The components forming an oxide with larger stability are more abundant in
the passive layers that those having oxides with lower stability. The passivation of the
alloy can be regarded as the partial dealloying of the surface layer and the subsequent
formation of a compact oxide from the remaining component. A typical example of
passive alloy with dissimilar surface oxide composition as compared to the bulk alloy
is stainless steel where chromium is essential in the formation of a stable protecting
oxide layer.
References
1. Brenner A (1963) Electrodeposition of alloys. Principles and practice. Academic Press, New
York and London
2. Dini JW (1993) Electrodeposition. The materials science of coatings and substrates. Noyes
publications, Park Ridge, New Jersey, USA
3. Gamburg YD, Zangari G (2011) Theory and practice of metal electrodeposition. Springer, New
York, Dordrecht, Heidelberg, London
4. Schlesinger M, Paunovich M (2010) Modern electroplating, 5th edn. John Wiley and Sons Inc.,
Hoboken, New Jersey
5. Kanani N (2004) Electrodeposition—basic principles, processes and practice. Elsevier, OxfordAmsterdam
6. Budevski E, Staikov G, Lorentz WJ (1996) Electrochemical phase formation and growth.
An introduction to the initial stages of metal deposition. VCH, Weinheim–New York–Basel–
Cambridge–Tokyo
7. Kiss L (1988) Kinetics of the electrochemical metal dissolution. Elsevier, Amsterdam–Oxford–
New York–Tokyo
8. Plieth W (2008) Electrochemistry for materials science. Elsevier, Amsterdam-Oxford
9. Watanabe T (2004) Nano-plating. Elsevier, Oxford
10. Bard AJ, Inzelt G, Scholz F (eds) (2012) Electrochemical dictionary, 2nd edn. Springer,
Heidelberg
11. Láng GG, Barbero CA (2012) Laser techniques for the study of electrode processes. In: Scholz
F (ed) Monographs in electrochemistry. Springer, Heidelberg, Chapter 1
12. Hamann CH, Hamnett A, Vielstich W (2007) Electrochemistry, 2nd edn. Wiley-VCH,
Weinheim, Chapter 4.3, pp 182–202
13. Damaskin BB, Petrii OA (2011) J Solid State Electrochem 15:1317–1334
14. Scharifker B, Hills G (1983) Electrochim Acta 28:879–889
15. Scharifker BR, Mostany J, Palomar-Pardavé M‚ González I (1999) J Electrochem Soc
146:1005–1012
16. Oviedo OA, Reinaudi L, García SG, Leiva EPM (2016) Underpotential deposition. From
fundamentals and theory to applications at the nanoscale. In: Scholz F (ed) Monographs in
electrochemistry. Springer, Berlin
17. Winand R (1994) Electrochim Acta 39:1091–1105
18. Puippe JC, Leaman F (1986) Theory and practise of pulse plating. American Electroplaters
and Surface Finishers Society, Orlando
19. Hansal WEG, Roy S (2012) Pulse plating. Eugen G Leuze Verlag KG, Bad Saulgau
20. Schwarzacher W (2004) J Phys Condens Matter 16:R859–R880
21. Plieth W, Lorenz WJ, Staikov G (2004) J Solid State Electrochem 8:941–946
53
passive layer does certainly not correspond to the ratio of these elements in the bulk
alloy. The components forming an oxide with larger stability are more abundant in
the passive layers that those having oxides with lower stability. The passivation of the
alloy can be regarded as the partial dealloying of the surface layer and the subsequent
formation of a compact oxide from the remaining component. A typical example of
passive alloy with dissimilar surface oxide composition as compared to the bulk alloy
is stainless steel where chromium is essential in the formation of a stable protecting
oxide layer.
References
1. Brenner A (1963) Electrodeposition of alloys. Principles and practice. Academic Press, New
York and London
2. Dini JW (1993) Electrodeposition. The materials science of coatings and substrates. Noyes
publications, Park Ridge, New Jersey, USA
3. Gamburg YD, Zangari G (2011) Theory and practice of metal electrodeposition. Springer, New
York, Dordrecht, Heidelberg, London
4. Schlesinger M, Paunovich M (2010) Modern electroplating, 5th edn. John Wiley and Sons Inc.,
Hoboken, New Jersey
5. Kanani N (2004) Electrodeposition—basic principles, processes and practice. Elsevier, OxfordAmsterdam
6. Budevski E, Staikov G, Lorentz WJ (1996) Electrochemical phase formation and growth.
An introduction to the initial stages of metal deposition. VCH, Weinheim–New York–Basel–
Cambridge–Tokyo
7. Kiss L (1988) Kinetics of the electrochemical metal dissolution. Elsevier, Amsterdam–Oxford–
New York–Tokyo
8. Plieth W (2008) Electrochemistry for materials science. Elsevier, Amsterdam-Oxford
9. Watanabe T (2004) Nano-plating. Elsevier, Oxford
10. Bard AJ, Inzelt G, Scholz F (eds) (2012) Electrochemical dictionary, 2nd edn. Springer,
Heidelberg
11. Láng GG, Barbero CA (2012) Laser techniques for the study of electrode processes. In: Scholz
F (ed) Monographs in electrochemistry. Springer, Heidelberg, Chapter 1
12. Hamann CH, Hamnett A, Vielstich W (2007) Electrochemistry, 2nd edn. Wiley-VCH,
Weinheim, Chapter 4.3, pp 182–202
13. Damaskin BB, Petrii OA (2011) J Solid State Electrochem 15:1317–1334
14. Scharifker B, Hills G (1983) Electrochim Acta 28:879–889
15. Scharifker BR, Mostany J, Palomar-Pardavé M‚ González I (1999) J Electrochem Soc
146:1005–1012
16. Oviedo OA, Reinaudi L, García SG, Leiva EPM (2016) Underpotential deposition. From
fundamentals and theory to applications at the nanoscale. In: Scholz F (ed) Monographs in
electrochemistry. Springer, Berlin
17. Winand R (1994) Electrochim Acta 39:1091–1105
18. Puippe JC, Leaman F (1986) Theory and practise of pulse plating. American Electroplaters
and Surface Finishers Society, Orlando
19. Hansal WEG, Roy S (2012) Pulse plating. Eugen G Leuze Verlag KG, Bad Saulgau
20. Schwarzacher W (2004) J Phys Condens Matter 16:R859–R880
21. Plieth W, Lorenz WJ, Staikov G (2004) J Solid State Electrochem 8:941–946