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of thermodynamics. Physical Review Letters.
Wang, T., Samal, S. K., Lim, S. K., & Shi, Y. (2019). Entropy production based full-chip fatigue
analysis: From theory to mobile applications. IEEE Transactions on Computer-Aided Design of
Integrated Circuits and Systems, 38(1).
Whales, P. W. (1983). Entropy production during fatigue as a criterion for failure: The critical
entropy threshold: A mathematical model for fatigue. U.S. Office of Naval Research Technical
Report No. 1, Govt. Accession No. A134767.
Whaley, P. W. (1983). A thermodynamic approach to metal fatigue. In Proceedings of the ASME
International Conference of Advances in Life Prediction Methods, Albany, NY (pp. 18-21).
Yao, W., & Basaran, C. (2012). Electromigration analysis of solder joints under ac load: A mean
time to failure model. Journal of Applied Physics, 111(6), 063703.
Yao, W., & Basaran, C. (2013a). Electromigration damage mechanics of lead-free solder joints
under pulsed DC loading: A computational model. Computational Materials Science, 71,
76–88.
Yao, W., & Basaran, C. (2013b). Electrical pulse induced impedance and material degradation in IC
chip packaging. Electronic Materials Letters, 9(5), 565–568.
Yao, W., & Basaran, C. (2013c). Computational damage mechanics of electromigration and
thermomigration. Journal of Applied Physics, 114, 103708.
Young, C., & Subbarayan, G. (2019b). Maximum entropy models for fatigue damage in metals with
application to low-cycle fatigue of aluminum 2024-T351. Entropy, 21(10), 967.
Young, C., & Subbarayan, G. (2019a). Maximum entropy models for fatigue damage aluminum
2024-T351. Entropy, 21, xx.
Yun, H., & Modarres, M. (2019). Measures of entropy to characterize fatigue damage in metallic
materials. Entropy, 21(8), 804.
Zhang, M.-H., Shen, X.-H., He, L., & Zhang, K.-S. (2018). Application of differential entropy in
characterizing the deformation inhomogeneity and life prediction of low-cycle fatigue of metals.
Materials, 11, 1917.
202
4 Unified Mechanics Theory