Chapter 28
Copper Nucleation on Nickel from
Pyrophosphate-Based Polyligand
Electrolyte
Antonnia Maizelis and Boris Bairachniy
28.1 Introduction
The copper nucleation on foreign substrates is a subject of great technological
interest. The process of copper thin film deposition has been widely used in
electronic industry for interconnects, manufacturing of printed circuit boards,
and multilayer sandwiches of GMR read heads for hard disk. It is also used
as commercial catalysts in fuel cells and in hydrogenation process [1]. The
electrodeposition of thin metal films is a viable alternative to vacuum-based
deposition processes, such as sputtering, plasma deposition, or chemical vapor
deposition [2]. The major advantages offered by the electrodeposition among several
deposition techniques are their simplicity, compatibility of the processing at room
temperature, and controllability of the thin film properties [3]. One-dimensional
(1D) nanostructured metallic materials (e.g., nanowires, nanorods, nanotubes, and
nanocones) [4], nanoparticles incorporated in conducting polymer films [5] and the
ones deposited on foreign substrates [3, 6], have attracted great attention, due to
their unique properties and potential applications in microelectronic interconnection, electrocatalysts, transparent electrodes, nanoprobes, solar cells [7], etc. As a
sensing material for electrochemical detection, copper nanostructures have many
unique properties such as the enhanced mass-transport rate, high surface-to-volume
ratio, and improved signal-to-noise ratio in electroanalytical measurements [8].
Managing the process of copper nucleation and growth is important in throughmold electrodeposition, such as that used by LIGA (lithographie, galvanoformung,
abformtechnik) microfabrication [9]. The kinetics of crystal formation and growth
is one of the determining factors in the formation of copper, copper-containing
A. Maizelis () · B. Bairachniy
National Technical University “Kharkiv Polytechnic Institute”, Kharkiv, Ukraine
© Springer International Publishing AG, part of Springer Nature 2018
O. Fesenko, L. Yatsenko (eds.), Nanochemistry, Biotechnology, Nanomaterials,
and Their Applications, Springer Proceedings in Physics 214,
https://doi.org/10.1007/978-3-319-92567-7_28
443
Copper Nucleation on Nickel from
Pyrophosphate-Based Polyligand
Electrolyte
Antonnia Maizelis and Boris Bairachniy
28.1 Introduction
The copper nucleation on foreign substrates is a subject of great technological
interest. The process of copper thin film deposition has been widely used in
electronic industry for interconnects, manufacturing of printed circuit boards,
and multilayer sandwiches of GMR read heads for hard disk. It is also used
as commercial catalysts in fuel cells and in hydrogenation process [1]. The
electrodeposition of thin metal films is a viable alternative to vacuum-based
deposition processes, such as sputtering, plasma deposition, or chemical vapor
deposition [2]. The major advantages offered by the electrodeposition among several
deposition techniques are their simplicity, compatibility of the processing at room
temperature, and controllability of the thin film properties [3]. One-dimensional
(1D) nanostructured metallic materials (e.g., nanowires, nanorods, nanotubes, and
nanocones) [4], nanoparticles incorporated in conducting polymer films [5] and the
ones deposited on foreign substrates [3, 6], have attracted great attention, due to
their unique properties and potential applications in microelectronic interconnection, electrocatalysts, transparent electrodes, nanoprobes, solar cells [7], etc. As a
sensing material for electrochemical detection, copper nanostructures have many
unique properties such as the enhanced mass-transport rate, high surface-to-volume
ratio, and improved signal-to-noise ratio in electroanalytical measurements [8].
Managing the process of copper nucleation and growth is important in throughmold electrodeposition, such as that used by LIGA (lithographie, galvanoformung,
abformtechnik) microfabrication [9]. The kinetics of crystal formation and growth
is one of the determining factors in the formation of copper, copper-containing
A. Maizelis () · B. Bairachniy
National Technical University “Kharkiv Polytechnic Institute”, Kharkiv, Ukraine
© Springer International Publishing AG, part of Springer Nature 2018
O. Fesenko, L. Yatsenko (eds.), Nanochemistry, Biotechnology, Nanomaterials,
and Their Applications, Springer Proceedings in Physics 214,
https://doi.org/10.1007/978-3-319-92567-7_28
443