Contributors
xiii

Baopu Li
Department of Electronic Engineering
The Chinese University of Hong Kong
Hong Kong, China
(e-mail: bpli@ee.cuhk.edu.hk)
W. H. Liao
Department of Mechanical and
Automation Engineering
The Chinese University of Hong Kong
Shatin, N.T., Hong Kong, China
(e-mail: whliao@mae.cuhk.edu.hk)
Yunhui Liu
Department of Precision Mechanical
and Automation Engineering
The Chinese University of Hong Kong
Hong Kong, China
(e-mail: yhliu@mae.cuhk.edu.hk)
Zhijian Long
Shenzhen Institutes of
Advanced Technology
Chinese Academy of Sciences
Shenzhen, China
(e-mail: zj.long@sub.siat.ac.cn)
and
The Chinese University of Hong Kong
Hong Kong, China
Congyi Lu
Department of Mechanical and
Automation Engineering
The Chinese University of Hong Kong
Hong Kong, China
(e-mail: cylu@mae.cuhk.edu.hk)
Shugen Ma
Department of Robotics
Ritsumeikan University
Shiga, Japan
(e-mail: shugen@se.ritsumei.ac.jp)
Yasushi Mae
Department of Systems Innovation
Osaka University
Osaka, Japan
(e-mail: mae@sys.es.osaka-u.ac.jp)
Kojiro Matsushita
Osaka University Medical School
Osaka, Japan
(e-mail: matsushita@nsurg.
med.osaka-u.ac.jp)
Max Q.-H. Meng
Department of Electronic Engineering
The Chinese University of Hong Kong
Hong Kong, China
(e-mail: max@ee.cuhk.edu.hk)
Aiguo Ming
Department of Mechanical Engineering
and Intelligent Systems
The University of
Electro-Communications
Tokyo, Japan
(e-mail: ming@mce.uec.ac.jp)
Masahiro Nakajima
Center For Micro-Nano Mechatronics
Nagoya University
Nagoya, Japan
(e-mail: nakajima@mein.nagoya-u.ac.jp)
Kenichi Ohara
Department of Systems Innovation
Osaka University
Osaka, Japan
(e-mail: k-oohara@ari-lab.
sys.es.osaka-u.ac.jp)
John Oyekan
School of Computer Science and
Electronic Engineering
University of Essex
Colchester, UK
(e-mail: jooyek@essex.ac.uk)
Weilun Poon
Department of Mechanical and
Automation Engineering
The Chinese University of Hong Kong
Hong Kong, China
(e-mail: wlpoon@mae.cuhk.edu.hk)