Index
205
P
Particle flux, 41, 45, 61, 75, 77, 85, 101, 120,
138, 139, 148, 157, 162, 171, 179,
196
Permeation, 29, 108, 110, 118, 120, 121,
123–125, 128, 161, 176, 178, 191
Permeation barrier, 121
Permeation spike, 123–125
Photoelectron, 62, 63
Photon, 6, 8–10, 14, 38, 41, 42, 49, 51, 52,
61–63, 68, 71, 75, 96, 97, 110, 128,
196, 199
Photon emission, 9, 37, 54, 55, 62
Physically removal, 181
Physical sputtering, 56–59, 77, 91, 137, 138,
188
Plasma center, 10, 20, 21, 23, 24, 27, 30, 98,
136, 187–189
Plasma collapse, 39, 42, 61
Plasma contamination, 11, 37, 57, 187
Plasma detachment, 41, 99
Plasma Driven Permeation (PDP), 123
Plasma induced desorption, 61
Plasma shadowed area, 58, 60, 71, 78, 80,
82, 86, 88, 92, 127, 148, 153, 163,
167–172, 180, 182, 183, 188, 192,
195
Plasma shaping, 192
Plastic deformation, 105, 106
Poloidal side, 86, 88
Postmortem analysis, 28, 30, 31
Potential energy diagram, 118
Powder Metallurgy (PM), 98, 105, 174
Power exhaust, 3, 10, 17, 39, 41, 45, 68, 70,
95, 188
Power generation, 6, 7, 141, 146, 190
Power load test, 25, 39, 40, 63, 133, 136, 189
Private flux region, 78, 79, 90, 91, 101, 150,
193
Projected range, 53, 104, 108, 117, 153
Prompt deposition, 57, 75, 77, 78, 85–87, 91,
92, 101, 154, 155, 188, 189, 192, 193
Proton Induced X-ray Emission (PIXE), 62
Pumping, 75, 79, 88, 143, 151, 155, 181
Pumping duct, 60, 78, 80, 82, 86, 90, 92
Pumping speed, 45, 162
Q
Quartz Micro Balance (QMB), 31, 33
R
Radial distribution, 125, 147
Radiation, 3, 5, 6, 9–12, 15, 17, 20, 21, 23–
25, 27–29, 38, 41–45, 49, 61–63, 68,
70, 95, 97, 98, 100, 101, 110, 129,
134, 136–138, 187, 188, 190, 191,
193–196, 199
Radiation cooling, 41, 193
Radiation damage, 14, 42, 49, 52, 68, 95,
109, 182, 190
Radiation Enhanced Sublimation (RES), 58,
59, 61, 77, 100, 101, 188, 191, 193
Radiative cooling, 117
Ramp-down, 42
Ramp-up, 42, 61, 66
Recoil atom, 8
Recombination, 64, 68, 70, 86, 121, 123, 124
Recombinational release, 121
Recombination plasma, 68
Recrystallization, 37, 39, 98, 99, 102, 103,
189, 190
Recycling coefficient, 97, 117, 148, 152
Redeposit, 89
Redeposited layer, 82, 90, 148, 156, 192
Reemission, 12, 37, 51, 53, 63–70, 104, 115,
117, 118, 120, 121, 123, 129, 149,
152, 153
Refinement, 115, 145, 161
Reflection, 29, 37, 49, 51, 53, 54, 62–64, 97,
118, 120, 129, 148, 152, 180
Reflection coefficient, 30, 54, 55, 63, 66, 121
Refueling, 15, 146
Relaxation, 8
Remote area, 15, 78, 80, 86–88, 92, 128, 137,
140, 141, 143, 144, 155, 163, 168,
170, 171, 189, 195
Remote handling, 181, 191, 192, 194
Replaceable cooled plates, 191
Residual gas, 11, 29, 49, 57, 117, 146, 149
Re-solidification, 37, 190
RF discharge, 181
Rhenium (Re), 188, 190
Ripple loss, 42, 138
Runaway electron, 43, 46, 62, 135
S
Saturation, 99, 104, 115, 120, 121, 148, 174,
178, 179, 191, 195
Saturation concentration, 44, 63, 99, 121,
122, 124, 148, 152, 155, 165, 168,
171, 172, 178–180, 183
Saw tooth activity, 42
Scanning laser, 181
Secondary electron, 8, 49, 61, 62, 110
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