8.8 Safety Control Technologies in Microelectronics
811
Functional units of the IC security testing center
Extended functional control
Analysis of the IC assembly in
package
IC chip analysis
Decapsulation
Plasma decapsulation
Local decapsulation
Layer-by-layer
analysis
Chemomechanical
polishing
Acoustic
microscopy
Fluidic
chemistry
Plasma
etching
Optical or SEM digitalization of the
layout
Electrical circuit recovery
Simulations
Comparison of layers to the
original (reference) IC
Delay in the
propagation of the
signal
Timing
characteristics
Power of transient
processes
Emission analysis
Analysis of statistical and dynamic
consumption currents
Identification of
lightly doped regions
Element
analysis
Run time method
Side channel
analysis
Circuit logic
analysis
Run time
method
Activation of
the Trojan of a
specific area
Trojan
activation
without
limitations in
termsofarea
Trojan
activation
Without Trojan
activation
X-Ray
microscopy
X-Ray
tomography
Photoemission
microscopy in the
range of 0.5-1.5
microns
Thermographic
analysis complex
SEM analysis (induced current
mode, potential contrast)
Fig. 8.13
Minimum composition of functional units (laboratories) of the microcircuit security testing center