202
9 Packaging of Group-III Nitride LED
13. N.H. Hashim, P. Anithambigai, D. Mutharasu, Thermal characterization of high-power LED
with ceramic particles filled thermal paste for effective heat dissipation. Microelectron. Reliab.
55(2), 383–388 (2015)
14. D. Wang, D. Chen, Y. Yang et al., Interface of Mo-Cu laminated composites by solid-state
bonding. Int. J. Refract Metal Hard Mater. 51, 239 (2015)
15. Y. Mamunyaa, V. Davydenkoa, P. Pissisb et al., Electrical and thermal conductivity of polymers
filled with metal powders. Eur. Polymer J. 38, 1887 (2002)
16. L. Li, C. Wang, Study and Application of Thermal Conductive Plastic. Chin. Polym. Bull. 7,
25 (2007). ((in Chinese))
17. Q. Kong, Z. Liu, J. Gao et al., Hierarchical graphene-carbon fiber composite paper as a flexible
lateral heat spreader. Adv. Funct. Mater. 24, 4222–4228 (2014)
18. A. Yang, J. Wang, J. Wang et al., Fluorescence spectrum of organic light transform films. J.
Optoelectron. Laser 16(1), 17–20 (2005)
19. T. Tsunemasa. Japanese semiconductor lighting project based on ultraviolet LED and phosphor
systems, in Proceedings of Conference on Solid State Lighting and Displays, Jul 31–Aug 1,
2001 (San Diego, 2001)
20. M.A. Khan, Deep-ultraviolet LEDs fabricated in AlInGaN using MEMOCVD, in Proceedings
of 4th International Conference on Solid State Lighting, 3–6 Aug 2004 (Denver, 2004).
21. D. Purnendu, Q. Li, H. Temkin et al., Applications of deep UV LEDs to chemical and biological
sensing, in Proceedings of 4th International Conference on Solid State Lighting, 3–6 Aug 2004
(Denver, 2004)
22. M. Hubert, C. Dimas, P. Orava et al., High-power UV LED array for curing photo-adhesives, in
Proceedings of 6th International Conference on Applications of Photonic Technology, 25–29
May 2003 (Montreal, 2003)
23. https://www.tslc.com.tw/news. Accessed 9 Jun 2020
24. https://www.semiconductor-today.com/news_items/2013/NOV/SETI_121113.shtml.
Accessed 9 Jun 2020
25. https://www.hplighting.com.tw/products.php. Accessed 9 Jun 2020
26. L. Kim, M. Shin, W. Moo, Thermal analysis and design of high-power LED packages and
systems, in Proceedings of 6th International Conference on Solid State Lighting, 14–17 Aug
2006 (San Diego, 2006)
27. I. Moreno, Configurations of LED arrays for uniform illumination, in Proceedings of 8th
Latin American Meeting on Optics, Lasers, and Their Applications, 3–8 Oct 2004 (Porlamar,
Venezuela, 2004)
28. D.A. Steigerwald, J.C. Bhat, D. Collins et al., Illumination with solid state lighting technology.
IEEE J. Sel. Top. Quantum Electron. 8(2), 310–320 (2002)
29. Z. Cong-fu, Wafer-level packaged LED by Panasonic. Semicond. Inf. 5, (2009) (in Chinese)
30. https://compoundsemiconductor.net/article/91810-toshiba-reveals-ultra-small-chip-whiteleds.html. Accessed 9 Jun 2020
31. N. Xuelei, T. Wang, X. Hu et al., Laser cooling with phase-change heat transfer in microgrooves
and TEC. J. Eng. Therm. 30, 8 (2009). ((in Chinese))
32. G. Farkas, Q. Vader, A. Poppe et al., Thermal investigation of high power optical devices by
transient testing. IEEE Trans. Compon. Packag. Technol. 28(1), 45–50 (2005)
33. J.R. Lin, T.Y. Ng, Z. Wang et al., Wafer-level LED-SiP based mobile flash module and
characterization. Microelectron. Reliab. 52(5), 916–921 (2012)
9 Packaging of Group-III Nitride LED
13. N.H. Hashim, P. Anithambigai, D. Mutharasu, Thermal characterization of high-power LED
with ceramic particles filled thermal paste for effective heat dissipation. Microelectron. Reliab.
55(2), 383–388 (2015)
14. D. Wang, D. Chen, Y. Yang et al., Interface of Mo-Cu laminated composites by solid-state
bonding. Int. J. Refract Metal Hard Mater. 51, 239 (2015)
15. Y. Mamunyaa, V. Davydenkoa, P. Pissisb et al., Electrical and thermal conductivity of polymers
filled with metal powders. Eur. Polymer J. 38, 1887 (2002)
16. L. Li, C. Wang, Study and Application of Thermal Conductive Plastic. Chin. Polym. Bull. 7,
25 (2007). ((in Chinese))
17. Q. Kong, Z. Liu, J. Gao et al., Hierarchical graphene-carbon fiber composite paper as a flexible
lateral heat spreader. Adv. Funct. Mater. 24, 4222–4228 (2014)
18. A. Yang, J. Wang, J. Wang et al., Fluorescence spectrum of organic light transform films. J.
Optoelectron. Laser 16(1), 17–20 (2005)
19. T. Tsunemasa. Japanese semiconductor lighting project based on ultraviolet LED and phosphor
systems, in Proceedings of Conference on Solid State Lighting and Displays, Jul 31–Aug 1,
2001 (San Diego, 2001)
20. M.A. Khan, Deep-ultraviolet LEDs fabricated in AlInGaN using MEMOCVD, in Proceedings
of 4th International Conference on Solid State Lighting, 3–6 Aug 2004 (Denver, 2004).
21. D. Purnendu, Q. Li, H. Temkin et al., Applications of deep UV LEDs to chemical and biological
sensing, in Proceedings of 4th International Conference on Solid State Lighting, 3–6 Aug 2004
(Denver, 2004)
22. M. Hubert, C. Dimas, P. Orava et al., High-power UV LED array for curing photo-adhesives, in
Proceedings of 6th International Conference on Applications of Photonic Technology, 25–29
May 2003 (Montreal, 2003)
23. https://www.tslc.com.tw/news. Accessed 9 Jun 2020
24. https://www.semiconductor-today.com/news_items/2013/NOV/SETI_121113.shtml.
Accessed 9 Jun 2020
25. https://www.hplighting.com.tw/products.php. Accessed 9 Jun 2020
26. L. Kim, M. Shin, W. Moo, Thermal analysis and design of high-power LED packages and
systems, in Proceedings of 6th International Conference on Solid State Lighting, 14–17 Aug
2006 (San Diego, 2006)
27. I. Moreno, Configurations of LED arrays for uniform illumination, in Proceedings of 8th
Latin American Meeting on Optics, Lasers, and Their Applications, 3–8 Oct 2004 (Porlamar,
Venezuela, 2004)
28. D.A. Steigerwald, J.C. Bhat, D. Collins et al., Illumination with solid state lighting technology.
IEEE J. Sel. Top. Quantum Electron. 8(2), 310–320 (2002)
29. Z. Cong-fu, Wafer-level packaged LED by Panasonic. Semicond. Inf. 5, (2009) (in Chinese)
30. https://compoundsemiconductor.net/article/91810-toshiba-reveals-ultra-small-chip-whiteleds.html. Accessed 9 Jun 2020
31. N. Xuelei, T. Wang, X. Hu et al., Laser cooling with phase-change heat transfer in microgrooves
and TEC. J. Eng. Therm. 30, 8 (2009). ((in Chinese))
32. G. Farkas, Q. Vader, A. Poppe et al., Thermal investigation of high power optical devices by
transient testing. IEEE Trans. Compon. Packag. Technol. 28(1), 45–50 (2005)
33. J.R. Lin, T.Y. Ng, Z. Wang et al., Wafer-level LED-SiP based mobile flash module and
characterization. Microelectron. Reliab. 52(5), 916–921 (2012)