194
9 Packaging of Group-III Nitride LED
size and full solid state. In contrast with UVB and UVC LEDs, UVA-LEDs have
higher luminous efficiency. The luminous efficiency of UVB and UVC-LEDs still
has great potential due to the use of different materials [18–22]. Ultraviolet light
plays an irreplaceable role in many areas including optical sensors and instruments
(230–400 nm), ultraviolet identification barcode (230–280 nm), ultraviolet water sterilization and purification (240–280 nm), identification and body liquid detection and
analysis (250–405 nm), protein analysis and pharmaceutical invention (270–300 nm),
medical light therapy (300–320 nm), polymer and ink printing (300–365 nm), money
detection (375–395 nm), sterilization (390–410 nm), and so on. In the production
and application of UV LEDs, efficient and reliable UV packaging are the important
links. Due to the high photon energy of UV light, the raw materials, processes and
testing methods used in conventional white light LED packaging may not be suitable
for UV-LEDs. UVA band LED has higher luminous efficiency, and its wavelength is
close to that of visible light band. Its packaging form is similar to the general LED
packaging, with more consideration in packaging raw materials and reliability. Due
to the fact that the efficiency of UVB and UVC-LED is still not high enough, light
source with module packaging form is an important way to enter the application
market.
TSLC recently published a series of complete UV-LED component products, UV
wavelength ranging from 365 to 420 nm. Using aluminum nitride (AIN) substrate
packaging technology to improve the UV-LED components and heat dissipation, it
can effectively conduct chip heat into the substrate. Furthermore, the light output
has adopted Quartz glass lens to reduce optical loss and increase the uniformity
[23]. Sensor Electronic Technology, Inc. (SETi) has launched a protective case for
mobile devices for reducing cross-infection [24]. High Power Lighting Corp. (HPL)
introduces the whole series of UV-LED (365–410 nm) package products currently
designed for different curing, printing, exposure and sterilization applications by
using the patented technology of copper substrate [25].
Encapsulation or packaging technology has an important impact on the improvement of UV-LED light power, heat dissipation and other performance. At present,
there have been a lot of researches on optics and heat [26, 27]. The main functions
of general package include mechanical support, heat dissipation, signal transmission, chip protection and so on. The package of LED needs to protect the chip from
mechanical, heat, moisture and other external impact under normal current flow, so
that the chip working temperature does not exceed the permitted range.
UV-LED encapsulation consists of several types, transistor outline (TO-can),
surface mounted devices (SMD), and chip on board (COB) package. In 2002, Nichia
introduced ceramic packaged UV-LED products with wavelengths ranging from 365
to 385 nm. Seoul Semiconductor’s SVC and firms in Taiwan have launched UV LED
products in metal substrate SMD packaging. Stanley Electric developed an ultraviolet
LED using a glass package and demonstrated it on “CEATEC JAPAN 2010”. SETi
UVTOP series has successfully launched 240–355 nm UV-LEDs products, which
are packaged in TO-39 and TO-18. In 2014, the firm announced the launch of its
latest SMD UVC-LED products. Packaging manufacturers in mainland China have
9 Packaging of Group-III Nitride LED
size and full solid state. In contrast with UVB and UVC LEDs, UVA-LEDs have
higher luminous efficiency. The luminous efficiency of UVB and UVC-LEDs still
has great potential due to the use of different materials [18–22]. Ultraviolet light
plays an irreplaceable role in many areas including optical sensors and instruments
(230–400 nm), ultraviolet identification barcode (230–280 nm), ultraviolet water sterilization and purification (240–280 nm), identification and body liquid detection and
analysis (250–405 nm), protein analysis and pharmaceutical invention (270–300 nm),
medical light therapy (300–320 nm), polymer and ink printing (300–365 nm), money
detection (375–395 nm), sterilization (390–410 nm), and so on. In the production
and application of UV LEDs, efficient and reliable UV packaging are the important
links. Due to the high photon energy of UV light, the raw materials, processes and
testing methods used in conventional white light LED packaging may not be suitable
for UV-LEDs. UVA band LED has higher luminous efficiency, and its wavelength is
close to that of visible light band. Its packaging form is similar to the general LED
packaging, with more consideration in packaging raw materials and reliability. Due
to the fact that the efficiency of UVB and UVC-LED is still not high enough, light
source with module packaging form is an important way to enter the application
market.
TSLC recently published a series of complete UV-LED component products, UV
wavelength ranging from 365 to 420 nm. Using aluminum nitride (AIN) substrate
packaging technology to improve the UV-LED components and heat dissipation, it
can effectively conduct chip heat into the substrate. Furthermore, the light output
has adopted Quartz glass lens to reduce optical loss and increase the uniformity
[23]. Sensor Electronic Technology, Inc. (SETi) has launched a protective case for
mobile devices for reducing cross-infection [24]. High Power Lighting Corp. (HPL)
introduces the whole series of UV-LED (365–410 nm) package products currently
designed for different curing, printing, exposure and sterilization applications by
using the patented technology of copper substrate [25].
Encapsulation or packaging technology has an important impact on the improvement of UV-LED light power, heat dissipation and other performance. At present,
there have been a lot of researches on optics and heat [26, 27]. The main functions
of general package include mechanical support, heat dissipation, signal transmission, chip protection and so on. The package of LED needs to protect the chip from
mechanical, heat, moisture and other external impact under normal current flow, so
that the chip working temperature does not exceed the permitted range.
UV-LED encapsulation consists of several types, transistor outline (TO-can),
surface mounted devices (SMD), and chip on board (COB) package. In 2002, Nichia
introduced ceramic packaged UV-LED products with wavelengths ranging from 365
to 385 nm. Seoul Semiconductor’s SVC and firms in Taiwan have launched UV LED
products in metal substrate SMD packaging. Stanley Electric developed an ultraviolet
LED using a glass package and demonstrated it on “CEATEC JAPAN 2010”. SETi
UVTOP series has successfully launched 240–355 nm UV-LEDs products, which
are packaged in TO-39 and TO-18. In 2014, the firm announced the launch of its
latest SMD UVC-LED products. Packaging manufacturers in mainland China have