4.3 Changes in Surface Stress during UPD
115
close to the bulk values [29]. For the Tl-UPD on the (111)-textured Au electrode as
well as the Pb-UPD, the hump of surface stress has been observed at the transition
potential between surface alloying and dealloying by long-term potentiostatic pulse
experiments [30].
4.3.2 Bi-UPD on Au (111)
Figure 4.7 shows (a) the cyclic voltammograms and (b) the vs. E curves measured
at a potential scan rate of 5 mV s
−1 for the (111)-textured Au thin-film (with a
Fig. 4.7 a Cyclic voltammograms and b the vs. E curves measured at a potential scan rate of
5 mV s −1 for the (111)-textured Au thin-film (with a thickness of 220 nm) electrode in 0.1 M HClO 4
solutions with and without 2.5 × 10 −3 M Bi 2 O 3 [14]. The solid and dotted curves represent the
results in the solutions with and without Bi 3+ , respectively. Reproduced from [14] with permission
from The Electrochemical Society
115
close to the bulk values [29]. For the Tl-UPD on the (111)-textured Au electrode as
well as the Pb-UPD, the hump of surface stress has been observed at the transition
potential between surface alloying and dealloying by long-term potentiostatic pulse
experiments [30].
4.3.2 Bi-UPD on Au (111)
Figure 4.7 shows (a) the cyclic voltammograms and (b) the vs. E curves measured
at a potential scan rate of 5 mV s
−1 for the (111)-textured Au thin-film (with a
Fig. 4.7 a Cyclic voltammograms and b the vs. E curves measured at a potential scan rate of
5 mV s −1 for the (111)-textured Au thin-film (with a thickness of 220 nm) electrode in 0.1 M HClO 4
solutions with and without 2.5 × 10 −3 M Bi 2 O 3 [14]. The solid and dotted curves represent the
results in the solutions with and without Bi 3+ , respectively. Reproduced from [14] with permission
from The Electrochemical Society