386
Index
cryogenic service, 353
electrical components, 339
hot service, 354
insulation material, 342–348
jacketing, 348–350
piping systems, 354–355
special environments, 354
structures, 337–338
tank design, 355
Detergent cleaning
for metal substrates, 222
plastic substrates, 226–227
Dew
and atmospheric corrosion, 81
and wet atmospheric corrosion, 92
Dezincification, 55, 56, 324, 325
Differential aeration cell, 10
Differential temperature cells, 8, 10
Direct dissolution, 73
Direct losses, 1–2
Disbondment, 219
Dissimilar electrode cells, 8, 9
Dissimilar metal corrosion, 36
Dissociative absorption, 95
Dissolution reactions, 16
Dissolved oxygen (DO), 365
Dry deposition velocity, 86, 93, 94
sulfur compounds, 98
Ductility
loss of, 58, 59–60
and selection of materials of
construction, 333
in steel, 60
Dull bright nickel deposits, 267
Duplex-grade stainless steels, corrosion
resistance, 125
Duplex nickel electrode deposit, 272
Dust, and atmospheric corrosion, 82
E
Eclipse molding framework (EMF)
control protection. See EMF
control protection
Economic considerations, materials of
construction, 334
Economic losses, 1–2
Edge failures, 207
Efficiency losses, 3
Elastomeric linings, 194–195
Elastomers, 78
ASTM designations, 133
atmospheric corrosion in, 133–134
atmospheric resistance, 135
brittle points, 138
low-temperature flexibility, 137
operating temperature ranges, 136
Electrical components, design
considerations, 339
Electrochemical corrosion, 255
Electrochemical reactors, stimulation by
microbes, 54
Electrochemical series, 256
Electrodeposition
anodic and cathodic, 236
nickel coatings, 269
polymers, 234–235
Electroless plating
gold-copper, 266
nickel coatings, 269
Electrolyte layer inhibition, 310
Electrolytes, and phase layers, 81
Electron transfer, 15
in chemisorption, 320
Electronic applications, gold coatings
in, 266
Electronic resistance, 200
Electroplating process, tinplate, 273
Electrosorption valency, 319
Electrostatic fluidized bed, 233, 234
Electrostatic powder spraying, 233
Electrostatic spray coating, 234
Elemental transfer, 73
EMF control protection, 255, 263, 296
by noble metals, 264–266
Emulsion cleaning, metal substrates,
223
Environment, 253
and current density requirements for
impressed current systems, 304
effect on concentration polarization
curve, 18
effects on anodic polarization
behavior, 23
role in selecting paint system, 242
and selective leaching, 56
Environmental cracking
in polymers, 169
Index
cryogenic service, 353
electrical components, 339
hot service, 354
insulation material, 342–348
jacketing, 348–350
piping systems, 354–355
special environments, 354
structures, 337–338
tank design, 355
Detergent cleaning
for metal substrates, 222
plastic substrates, 226–227
Dew
and atmospheric corrosion, 81
and wet atmospheric corrosion, 92
Dezincification, 55, 56, 324, 325
Differential aeration cell, 10
Differential temperature cells, 8, 10
Direct dissolution, 73
Direct losses, 1–2
Disbondment, 219
Dissimilar electrode cells, 8, 9
Dissimilar metal corrosion, 36
Dissociative absorption, 95
Dissolution reactions, 16
Dissolved oxygen (DO), 365
Dry deposition velocity, 86, 93, 94
sulfur compounds, 98
Ductility
loss of, 58, 59–60
and selection of materials of
construction, 333
in steel, 60
Dull bright nickel deposits, 267
Duplex-grade stainless steels, corrosion
resistance, 125
Duplex nickel electrode deposit, 272
Dust, and atmospheric corrosion, 82
E
Eclipse molding framework (EMF)
control protection. See EMF
control protection
Economic considerations, materials of
construction, 334
Economic losses, 1–2
Edge failures, 207
Efficiency losses, 3
Elastomeric linings, 194–195
Elastomers, 78
ASTM designations, 133
atmospheric corrosion in, 133–134
atmospheric resistance, 135
brittle points, 138
low-temperature flexibility, 137
operating temperature ranges, 136
Electrical components, design
considerations, 339
Electrochemical corrosion, 255
Electrochemical reactors, stimulation by
microbes, 54
Electrochemical series, 256
Electrodeposition
anodic and cathodic, 236
nickel coatings, 269
polymers, 234–235
Electroless plating
gold-copper, 266
nickel coatings, 269
Electrolyte layer inhibition, 310
Electrolytes, and phase layers, 81
Electron transfer, 15
in chemisorption, 320
Electronic applications, gold coatings
in, 266
Electronic resistance, 200
Electroplating process, tinplate, 273
Electrosorption valency, 319
Electrostatic fluidized bed, 233, 234
Electrostatic powder spraying, 233
Electrostatic spray coating, 234
Elemental transfer, 73
EMF control protection, 255, 263, 296
by noble metals, 264–266
Emulsion cleaning, metal substrates,
223
Environment, 253
and current density requirements for
impressed current systems, 304
effect on concentration polarization
curve, 18
effects on anodic polarization
behavior, 23
role in selecting paint system, 242
and selective leaching, 56
Environmental cracking
in polymers, 169