Aims and Scope
Structure and Bonding is a publication which uniquely bridges the journal and book
format. Organized into topical volumes, the series publishes in depth and critical
reviews on all topics concerning structure and bonding. With over 50 years of
history, the series has developed from covering theoretical methods for simple
molecules to more complex systems.
Topics addressed in the series now include the design and engineering of molecular
solids such as molecular machines, surfaces, two dimensional materials, metal
clusters and supramolecular species based either on complementary hydrogen bonding networks or metal coordination centers in metal-organic framework materials
(MOFs). Also of interest is the study of reaction coordinates of organometallic
transformations and catalytic processes, and the electronic properties of metal ions
involved in important biochemical enzymatic reactions.
Volumes on physical and spectroscopic techniques used to provide insights into
structural and bonding problems, as well as experimental studies associated with the
development of bonding models, reactivity pathways and rates of chemical processes are also relevant for the series.
Structure and Bonding is able to contribute to the challenges of communicating the
enormous amount of data now produced in contemporary research by producing
volumes which summarize important developments in selected areas of current
interest and provide the conceptual framework necessary to use and interpret
mega-databases.
We welcome proposals for volumes in the series within the scope mentioned above.
Structure and Bonding offers our authors and readers:
• OnlineFirst publication. Each chapter is published online as it is finished, ahead
of the print volume
• Wide dissemination. The chapters and the volume will be available on our
platform SpringerLink, one of the largest collections of scholarly content in the
world. SpringerLink attracts more than 50 million users at 15.000 institutions
worldwide.
• Easy manuscript preparation. Authors do not have to spend their valuable time on
the layout of their contribution. Springer will take care of all the layout related
issues and will provide support throughout the complete process.
More information about this series at http://www.springer.com/series/430
Structure and Bonding is a publication which uniquely bridges the journal and book
format. Organized into topical volumes, the series publishes in depth and critical
reviews on all topics concerning structure and bonding. With over 50 years of
history, the series has developed from covering theoretical methods for simple
molecules to more complex systems.
Topics addressed in the series now include the design and engineering of molecular
solids such as molecular machines, surfaces, two dimensional materials, metal
clusters and supramolecular species based either on complementary hydrogen bonding networks or metal coordination centers in metal-organic framework materials
(MOFs). Also of interest is the study of reaction coordinates of organometallic
transformations and catalytic processes, and the electronic properties of metal ions
involved in important biochemical enzymatic reactions.
Volumes on physical and spectroscopic techniques used to provide insights into
structural and bonding problems, as well as experimental studies associated with the
development of bonding models, reactivity pathways and rates of chemical processes are also relevant for the series.
Structure and Bonding is able to contribute to the challenges of communicating the
enormous amount of data now produced in contemporary research by producing
volumes which summarize important developments in selected areas of current
interest and provide the conceptual framework necessary to use and interpret
mega-databases.
We welcome proposals for volumes in the series within the scope mentioned above.
Structure and Bonding offers our authors and readers:
• OnlineFirst publication. Each chapter is published online as it is finished, ahead
of the print volume
• Wide dissemination. The chapters and the volume will be available on our
platform SpringerLink, one of the largest collections of scholarly content in the
world. SpringerLink attracts more than 50 million users at 15.000 institutions
worldwide.
• Easy manuscript preparation. Authors do not have to spend their valuable time on
the layout of their contribution. Springer will take care of all the layout related
issues and will provide support throughout the complete process.
More information about this series at http://www.springer.com/series/430