Friction Stir Additive Manufacturing—A Review
15
Fig. 1 Graphic representation of the seven families of additive manufacturing that encompasses
all the process for metal additive manufacturing according to ASTM F2792 Standards [29]
Materials (ASTM) [3], only a handful of technologies are actually viable for industrial application. Powder bed fusion and direct energy deposition are the two major
fields that are opted for commercial applications. These are high-energy and hightemperature methods which employ the use of laser and electron beams to fabricate
components. At present, the majority of multi-layered metal fabrication methods
are high-energy and high-temperature methods [17–24] limited to laser-based techniques, electron beam melting and shaped metal deposition [25–28]. Laser beam
melting (LBM), electron beam melting (EBM) and laser metal deposition (LMD)
have the highest industrial relevance currently [2]. Though these technologies have
come to the forefront by virtue of several innovations, numerous key challenges
persist.
15
Fig. 1 Graphic representation of the seven families of additive manufacturing that encompasses
all the process for metal additive manufacturing according to ASTM F2792 Standards [29]
Materials (ASTM) [3], only a handful of technologies are actually viable for industrial application. Powder bed fusion and direct energy deposition are the two major
fields that are opted for commercial applications. These are high-energy and hightemperature methods which employ the use of laser and electron beams to fabricate
components. At present, the majority of multi-layered metal fabrication methods
are high-energy and high-temperature methods [17–24] limited to laser-based techniques, electron beam melting and shaped metal deposition [25–28]. Laser beam
melting (LBM), electron beam melting (EBM) and laser metal deposition (LMD)
have the highest industrial relevance currently [2]. Though these technologies have
come to the forefront by virtue of several innovations, numerous key challenges
persist.
